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Nickel 200 vs. C12500 Copper

Nickel 200 belongs to the nickel alloys classification, while C12500 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is nickel 200 and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
120
Elongation at Break, % 23 to 44
1.5 to 50
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 70
43
Shear Strength, MPa 300 to 340
150 to 220
Tensile Strength: Ultimate (UTS), MPa 420 to 540
220 to 420
Tensile Strength: Yield (Proof), MPa 120 to 370
75 to 390

Thermal Properties

Latent Heat of Fusion, J/g 290
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1460
1080
Melting Onset (Solidus), °C 1440
1070
Specific Heat Capacity, J/kg-K 450
390
Thermal Conductivity, W/m-K 69
350
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
92
Electrical Conductivity: Equal Weight (Specific), % IACS 18
93

Otherwise Unclassified Properties

Base Metal Price, % relative 65
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 11
2.6
Embodied Energy, MJ/kg 150
41
Embodied Water, L/kg 230
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110 to 150
5.6 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 42 to 370
24 to 660
Stiffness to Weight: Axial, points 11
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 13 to 17
6.9 to 13
Strength to Weight: Bending, points 14 to 17
9.1 to 14
Thermal Diffusivity, mm2/s 17
100
Thermal Shock Resistance, points 13 to 16
7.8 to 15

Alloy Composition

Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 0 to 0.25
99.88 to 100
Iron (Fe), % 0 to 0.4
0
Lead (Pb), % 0
0 to 0.0040
Manganese (Mn), % 0 to 0.35
0
Nickel (Ni), % 99 to 100
0 to 0.050
Silicon (Si), % 0 to 0.35
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0
0 to 0.3