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SAE-AISI 1090 Steel vs. C82500 Copper

SAE-AISI 1090 steel belongs to the iron alloys classification, while C82500 copper belongs to the copper alloys. There are 27 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is SAE-AISI 1090 steel and the bottom bar is C82500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
120
Elongation at Break, % 11
1.0 to 20
Poisson's Ratio 0.29
0.33
Shear Modulus, GPa 72
45
Tensile Strength: Ultimate (UTS), MPa 790 to 950
550 to 1100
Tensile Strength: Yield (Proof), MPa 520 to 610
310 to 980

Thermal Properties

Latent Heat of Fusion, J/g 240
240
Maximum Temperature: Mechanical, °C 400
280
Melting Completion (Liquidus), °C 1450
980
Melting Onset (Solidus), °C 1410
860
Specific Heat Capacity, J/kg-K 470
390
Thermal Conductivity, W/m-K 50
130
Thermal Expansion, µm/m-K 12
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.1
20
Electrical Conductivity: Equal Weight (Specific), % IACS 8.2
21

Otherwise Unclassified Properties

Density, g/cm3 7.8
8.8
Embodied Carbon, kg CO2/kg material 1.4
10
Embodied Energy, MJ/kg 19
160
Embodied Water, L/kg 46
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 82 to 91
11 to 94
Resilience: Unit (Modulus of Resilience), kJ/m3 730 to 1000
400 to 4000
Stiffness to Weight: Axial, points 13
7.7
Stiffness to Weight: Bending, points 24
19
Strength to Weight: Axial, points 28 to 34
18 to 35
Strength to Weight: Bending, points 24 to 27
17 to 27
Thermal Diffusivity, mm2/s 13
38
Thermal Shock Resistance, points 25 to 31
19 to 38

Alloy Composition

Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
1.9 to 2.3
Carbon (C), % 0.85 to 1.0
0
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 0
95.3 to 97.8
Iron (Fe), % 98 to 98.6
0 to 0.25
Lead (Pb), % 0
0 to 0.020
Manganese (Mn), % 0.6 to 0.9
0
Nickel (Ni), % 0
0 to 0.2
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0
0.2 to 0.35
Sulfur (S), % 0 to 0.050
0
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0
0 to 0.5