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C11100 Copper vs. Solder Alloy 101

C11100 copper belongs to the copper alloys classification, while solder alloy 101 belongs to the otherwise unclassified metals. There are 26 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C11100 copper and the bottom bar is solder alloy 101.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
38
Elongation at Break, % 1.5
48
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 44
14
Tensile Strength: Ultimate (UTS), MPa 460
31
Tensile Strength: Yield (Proof), MPa 420
27

Thermal Properties

Latent Heat of Fusion, J/g 210
46
Melting Completion (Liquidus), °C 1080
180
Melting Onset (Solidus), °C 1070
180
Specific Heat Capacity, J/kg-K 390
190
Thermal Conductivity, W/m-K 390
51
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
12
Electrical Conductivity: Equal Weight (Specific), % IACS 100
12

Otherwise Unclassified Properties

Density, g/cm3 9.0
8.8
Embodied Carbon, kg CO2/kg material 2.6
11
Embodied Energy, MJ/kg 41
180
Embodied Water, L/kg 310
930

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 6.6
14
Resilience: Unit (Modulus of Resilience), kJ/m3 750
9.9
Stiffness to Weight: Axial, points 7.2
2.4
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 14
1.0
Strength to Weight: Bending, points 15
2.5
Thermal Diffusivity, mm2/s 110
31
Thermal Shock Resistance, points 16
2.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.9 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
35.8 to 37.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
62.5 to 63.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.1
0