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C11400 Copper vs. Solder Alloy 122

C11400 copper belongs to the copper alloys classification, while solder alloy 122 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C11400 copper and the bottom bar is solder alloy 122.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
20
Elongation at Break, % 2.8 to 51
30
Poisson's Ratio 0.34
0.43
Shear Modulus, GPa 43
6.9
Tensile Strength: Ultimate (UTS), MPa 220 to 400
30

Thermal Properties

Latent Heat of Fusion, J/g 210
27
Melting Completion (Liquidus), °C 1080
300
Melting Onset (Solidus), °C 1030
270
Specific Heat Capacity, J/kg-K 390
140
Thermal Conductivity, W/m-K 390
25
Thermal Expansion, µm/m-K 17
28

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
8.9
Electrical Conductivity: Equal Weight (Specific), % IACS 100
7.3

Otherwise Unclassified Properties

Base Metal Price, % relative 32
75
Density, g/cm3 9.0
11
Embodied Carbon, kg CO2/kg material 2.6
5.0
Embodied Energy, MJ/kg 42
84
Embodied Water, L/kg 350
540

Common Calculations

Stiffness to Weight: Axial, points 7.2
1.0
Stiffness to Weight: Bending, points 18
8.2
Strength to Weight: Axial, points 6.8 to 12
0.77
Strength to Weight: Bending, points 9.1 to 14
2.0
Thermal Diffusivity, mm2/s 110
17
Thermal Shock Resistance, points 7.8 to 14
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 99.84 to 99.966
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
88.4 to 90.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0.034 to 0.060
0 to 0.1
Tin (Sn), % 0
9.5 to 10.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.1
0