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C11600 Copper vs. EN 2.4663 Nickel

C11600 copper belongs to the copper alloys classification, while EN 2.4663 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C11600 copper and the bottom bar is EN 2.4663 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
210
Elongation at Break, % 2.7 to 50
40
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 43
81
Shear Strength, MPa 160 to 240
540
Tensile Strength: Ultimate (UTS), MPa 230 to 410
780
Tensile Strength: Yield (Proof), MPa 77 to 410
310

Thermal Properties

Latent Heat of Fusion, J/g 210
320
Maximum Temperature: Mechanical, °C 200
1010
Melting Completion (Liquidus), °C 1080
1430
Melting Onset (Solidus), °C 1030
1380
Specific Heat Capacity, J/kg-K 390
450
Thermal Conductivity, W/m-K 390
13
Thermal Expansion, µm/m-K 17
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
1.4
Electrical Conductivity: Equal Weight (Specific), % IACS 100
1.5

Otherwise Unclassified Properties

Base Metal Price, % relative 35
75
Density, g/cm3 9.0
8.6
Embodied Carbon, kg CO2/kg material 2.7
11
Embodied Energy, MJ/kg 42
140
Embodied Water, L/kg 390
350

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 9.7 to 91
250
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 710
230
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
23
Strength to Weight: Axial, points 7.2 to 13
25
Strength to Weight: Bending, points 9.4 to 14
22
Thermal Diffusivity, mm2/s 110
3.5
Thermal Shock Resistance, points 8.2 to 15
22

Alloy Composition

Aluminum (Al), % 0
0.7 to 1.4
Boron (B), % 0
0 to 0.0060
Carbon (C), % 0
0.050 to 0.1
Chromium (Cr), % 0
20 to 23
Cobalt (Co), % 0
11 to 14
Copper (Cu), % 99.78 to 99.915
0 to 0.5
Iron (Fe), % 0
0 to 2.0
Manganese (Mn), % 0
0 to 0.2
Molybdenum (Mo), % 0
8.5 to 10
Nickel (Ni), % 0
48 to 59.6
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0
0 to 0.2
Silver (Ag), % 0.085 to 0.12
0
Sulfur (S), % 0
0 to 0.010
Titanium (Ti), % 0
0.2 to 0.6
Residuals, % 0 to 0.1
0