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C11600 Copper vs. EN 2.4669 Nickel

C11600 copper belongs to the copper alloys classification, while EN 2.4669 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C11600 copper and the bottom bar is EN 2.4669 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 2.7 to 50
16
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 43
73
Shear Strength, MPa 160 to 240
680
Tensile Strength: Ultimate (UTS), MPa 230 to 410
1110
Tensile Strength: Yield (Proof), MPa 77 to 410
720

Thermal Properties

Latent Heat of Fusion, J/g 210
310
Maximum Temperature: Mechanical, °C 200
960
Melting Completion (Liquidus), °C 1080
1380
Melting Onset (Solidus), °C 1030
1330
Specific Heat Capacity, J/kg-K 390
460
Thermal Conductivity, W/m-K 390
12
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
1.4
Electrical Conductivity: Equal Weight (Specific), % IACS 100
1.5

Otherwise Unclassified Properties

Base Metal Price, % relative 35
60
Density, g/cm3 9.0
8.4
Embodied Carbon, kg CO2/kg material 2.7
10
Embodied Energy, MJ/kg 42
150
Embodied Water, L/kg 390
260

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 9.7 to 91
160
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 710
1380
Stiffness to Weight: Axial, points 7.2
13
Stiffness to Weight: Bending, points 18
23
Strength to Weight: Axial, points 7.2 to 13
37
Strength to Weight: Bending, points 9.4 to 14
28
Thermal Diffusivity, mm2/s 110
3.1
Thermal Shock Resistance, points 8.2 to 15
33

Alloy Composition

Aluminum (Al), % 0
0.4 to 1.0
Carbon (C), % 0
0 to 0.080
Chromium (Cr), % 0
14 to 17
Cobalt (Co), % 0
0 to 1.0
Copper (Cu), % 99.78 to 99.915
0 to 0.5
Iron (Fe), % 0
5.0 to 9.0
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0
65.9 to 77.7
Niobium (Nb), % 0
0.7 to 1.2
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0.085 to 0.12
0
Sulfur (S), % 0
0 to 0.015
Titanium (Ti), % 0
2.3 to 2.8
Residuals, % 0 to 0.1
0