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C11600 Copper vs. Solder Alloy 113

C11600 copper belongs to the copper alloys classification, while solder alloy 113 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C11600 copper and the bottom bar is solder alloy 113.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
32
Elongation at Break, % 2.7 to 50
32
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 43
11
Tensile Strength: Ultimate (UTS), MPa 230 to 410
39

Thermal Properties

Latent Heat of Fusion, J/g 210
40
Melting Completion (Liquidus), °C 1080
230
Melting Onset (Solidus), °C 1030
180
Specific Heat Capacity, J/kg-K 390
170
Thermal Conductivity, W/m-K 390
46
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
10
Electrical Conductivity: Equal Weight (Specific), % IACS 100
9.8

Otherwise Unclassified Properties

Density, g/cm3 9.0
9.5
Embodied Carbon, kg CO2/kg material 2.7
8.9
Embodied Energy, MJ/kg 42
150
Embodied Water, L/kg 390
800

Common Calculations

Stiffness to Weight: Axial, points 7.2
1.8
Stiffness to Weight: Bending, points 18
11
Strength to Weight: Axial, points 7.2 to 13
1.1
Strength to Weight: Bending, points 9.4 to 14
2.7
Thermal Diffusivity, mm2/s 110
28
Thermal Shock Resistance, points 8.2 to 15
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 99.78 to 99.915
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
53.4 to 55.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0.085 to 0.12
0 to 0.1
Tin (Sn), % 0
44.5 to 45.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.1
0