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C12500 Copper vs. ASTM A369 Grade FP9

C12500 copper belongs to the copper alloys classification, while ASTM A369 grade FP9 belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C12500 copper and the bottom bar is ASTM A369 grade FP9.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 1.5 to 50
20
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
75
Shear Strength, MPa 150 to 220
300
Tensile Strength: Ultimate (UTS), MPa 220 to 420
470
Tensile Strength: Yield (Proof), MPa 75 to 390
240

Thermal Properties

Latent Heat of Fusion, J/g 210
270
Maximum Temperature: Mechanical, °C 200
600
Melting Completion (Liquidus), °C 1080
1450
Melting Onset (Solidus), °C 1070
1410
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 350
26
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 92
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 93
10

Otherwise Unclassified Properties

Base Metal Price, % relative 31
6.5
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 2.6
2.0
Embodied Energy, MJ/kg 41
28
Embodied Water, L/kg 310
87

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 5.6 to 88
80
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 660
140
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 6.9 to 13
17
Strength to Weight: Bending, points 9.1 to 14
17
Thermal Diffusivity, mm2/s 100
6.9
Thermal Shock Resistance, points 7.8 to 15
13

Alloy Composition

Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Carbon (C), % 0
0 to 0.15
Chromium (Cr), % 0
8.0 to 10
Copper (Cu), % 99.88 to 100
0
Iron (Fe), % 0
87.1 to 90.3
Lead (Pb), % 0 to 0.0040
0
Manganese (Mn), % 0
0.3 to 0.6
Molybdenum (Mo), % 0
0.9 to 1.1
Nickel (Ni), % 0 to 0.050
0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0.5 to 1.0
Sulfur (S), % 0
0 to 0.030
Tellurium (Te), % 0 to 0.025
0
Residuals, % 0 to 0.3
0