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C12500 Copper vs. C83400 Brass

Both C12500 copper and C83400 brass are copper alloys. They have a moderately high 90% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C12500 copper and the bottom bar is C83400 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 1.5 to 50
30
Poisson's Ratio 0.34
0.33
Rockwell F Hardness 40 to 95
50
Shear Modulus, GPa 43
42
Tensile Strength: Ultimate (UTS), MPa 220 to 420
240
Tensile Strength: Yield (Proof), MPa 75 to 390
69

Thermal Properties

Latent Heat of Fusion, J/g 210
200
Maximum Temperature: Mechanical, °C 200
180
Melting Completion (Liquidus), °C 1080
1040
Melting Onset (Solidus), °C 1070
1020
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 350
190
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 92
44
Electrical Conductivity: Equal Weight (Specific), % IACS 93
46

Otherwise Unclassified Properties

Base Metal Price, % relative 31
29
Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 2.6
2.7
Embodied Energy, MJ/kg 41
43
Embodied Water, L/kg 310
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 5.6 to 88
55
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 660
21
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.9 to 13
7.7
Strength to Weight: Bending, points 9.1 to 14
9.9
Thermal Diffusivity, mm2/s 100
57
Thermal Shock Resistance, points 7.8 to 15
8.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0050
Antimony (Sb), % 0 to 0.0030
0 to 0.25
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Copper (Cu), % 99.88 to 100
88 to 92
Iron (Fe), % 0
0 to 0.25
Lead (Pb), % 0 to 0.0040
0 to 0.5
Nickel (Ni), % 0 to 0.050
0 to 1.0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0 to 0.0050
Sulfur (S), % 0
0 to 0.080
Tellurium (Te), % 0 to 0.025
0
Tin (Sn), % 0
0 to 0.2
Zinc (Zn), % 0
8.0 to 12
Residuals, % 0
0 to 0.7