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C17200 Copper vs. ACI-ASTM CK3MCuN Steel

C17200 copper belongs to the copper alloys classification, while ACI-ASTM CK3MCuN steel belongs to the iron alloys. There are 27 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C17200 copper and the bottom bar is ACI-ASTM CK3MCuN steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 1.1 to 37
39
Poisson's Ratio 0.33
0.28
Shear Modulus, GPa 45
80
Tensile Strength: Ultimate (UTS), MPa 480 to 1380
620
Tensile Strength: Yield (Proof), MPa 160 to 1250
290

Thermal Properties

Latent Heat of Fusion, J/g 230
300
Maximum Temperature: Mechanical, °C 280
1090
Melting Completion (Liquidus), °C 980
1460
Melting Onset (Solidus), °C 870
1350
Specific Heat Capacity, J/kg-K 390
460
Thermal Conductivity, W/m-K 110
12
Thermal Expansion, µm/m-K 18
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
1.9
Electrical Conductivity: Equal Weight (Specific), % IACS 23
2.1

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.0
Embodied Carbon, kg CO2/kg material 9.4
5.6
Embodied Energy, MJ/kg 150
76
Embodied Water, L/kg 310
190

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 500
200
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5720
210
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 15 to 44
21
Strength to Weight: Bending, points 16 to 31
20
Thermal Diffusivity, mm2/s 31
3.2
Thermal Shock Resistance, points 16 to 46
14

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.025
Chromium (Cr), % 0
19.5 to 20.5
Copper (Cu), % 96.1 to 98
0.5 to 1.0
Iron (Fe), % 0 to 0.4
49.5 to 56.3
Manganese (Mn), % 0
0 to 1.2
Molybdenum (Mo), % 0
6.0 to 7.0
Nickel (Ni), % 0.2 to 0.6
17.5 to 19.5
Nitrogen (N), % 0
0.18 to 0.24
Phosphorus (P), % 0
0 to 0.045
Silicon (Si), % 0 to 0.2
0 to 1.0
Sulfur (S), % 0
0 to 0.010
Residuals, % 0 to 0.5
0