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C19000 Copper vs. Solder Alloy 133

C19000 copper belongs to the copper alloys classification, while solder alloy 133 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C19000 copper and the bottom bar is solder alloy 133.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 2.5 to 50
34
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 43
12
Tensile Strength: Ultimate (UTS), MPa 260 to 760
41

Thermal Properties

Latent Heat of Fusion, J/g 210
42
Melting Completion (Liquidus), °C 1080
220
Melting Onset (Solidus), °C 1040
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 250
47
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
11
Electrical Conductivity: Equal Weight (Specific), % IACS 61
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 2.7
9.4
Embodied Energy, MJ/kg 42
160
Embodied Water, L/kg 310
840

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.0
Stiffness to Weight: Bending, points 18
12
Strength to Weight: Axial, points 8.2 to 24
1.2
Strength to Weight: Bending, points 10 to 21
2.9
Thermal Diffusivity, mm2/s 73
29
Thermal Shock Resistance, points 9.3 to 27
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0.2 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 96.9 to 99
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.050
48.5 to 50.3
Nickel (Ni), % 0.9 to 1.3
0 to 0.010
Phosphorus (P), % 0.15 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0 to 0.8
0 to 0.0010
Residuals, % 0 to 0.5
0