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C68400 Brass vs. C12500 Copper

Both C68400 brass and C12500 copper are copper alloys. They have 62% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C68400 brass and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 18
1.5 to 50
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 41
43
Shear Strength, MPa 330
150 to 220
Tensile Strength: Ultimate (UTS), MPa 540
220 to 420
Tensile Strength: Yield (Proof), MPa 310
75 to 390

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 130
200
Melting Completion (Liquidus), °C 840
1080
Melting Onset (Solidus), °C 820
1070
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 66
350
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 87
92
Electrical Conductivity: Equal Weight (Specific), % IACS 99
93

Otherwise Unclassified Properties

Base Metal Price, % relative 23
31
Density, g/cm3 7.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
2.6
Embodied Energy, MJ/kg 47
41
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 81
5.6 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 460
24 to 660
Stiffness to Weight: Axial, points 7.5
7.2
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 19
6.9 to 13
Strength to Weight: Bending, points 19
9.1 to 14
Thermal Diffusivity, mm2/s 21
100
Thermal Shock Resistance, points 18
7.8 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.5
0
Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Boron (B), % 0.0010 to 0.030
0
Copper (Cu), % 59 to 64
99.88 to 100
Iron (Fe), % 0 to 1.0
0
Lead (Pb), % 0 to 0.090
0 to 0.0040
Manganese (Mn), % 0.2 to 1.5
0
Nickel (Ni), % 0 to 0.5
0 to 0.050
Phosphorus (P), % 0.030 to 0.3
0
Silicon (Si), % 1.5 to 2.5
0
Tellurium (Te), % 0
0 to 0.025
Tin (Sn), % 0 to 0.5
0
Zinc (Zn), % 28.6 to 39.3
0
Residuals, % 0
0 to 0.3