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C70400 Copper-nickel vs. Solder Alloy 133

C70400 copper-nickel belongs to the copper alloys classification, while solder alloy 133 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C70400 copper-nickel and the bottom bar is solder alloy 133.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 45
12
Tensile Strength: Ultimate (UTS), MPa 300 to 310
41

Thermal Properties

Latent Heat of Fusion, J/g 210
42
Melting Completion (Liquidus), °C 1120
220
Melting Onset (Solidus), °C 1060
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 64
47
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
11
Electrical Conductivity: Equal Weight (Specific), % IACS 14
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 3.0
9.4
Embodied Energy, MJ/kg 47
160
Embodied Water, L/kg 300
840

Common Calculations

Stiffness to Weight: Axial, points 7.5
2.0
Stiffness to Weight: Bending, points 19
12
Strength to Weight: Axial, points 9.3 to 9.8
1.2
Strength to Weight: Bending, points 11 to 12
2.9
Thermal Diffusivity, mm2/s 18
29
Thermal Shock Resistance, points 10 to 11
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0.2 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 89.8 to 93.6
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 1.3 to 1.7
0 to 0.020
Lead (Pb), % 0 to 0.050
48.5 to 50.3
Manganese (Mn), % 0.3 to 0.8
0
Nickel (Ni), % 4.8 to 6.2
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0