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C71500 Copper-nickel vs. Solder Alloy 502

C71500 copper-nickel belongs to the copper alloys classification, while solder alloy 502 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C71500 copper-nickel and the bottom bar is solder alloy 502.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
53
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 52
19
Tensile Strength: Ultimate (UTS), MPa 380 to 620
58

Thermal Properties

Latent Heat of Fusion, J/g 230
66
Melting Completion (Liquidus), °C 1240
350
Melting Onset (Solidus), °C 1170
220
Specific Heat Capacity, J/kg-K 400
230
Thermal Conductivity, W/m-K 28
47
Thermal Expansion, µm/m-K 16
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 4.6
12
Electrical Conductivity: Equal Weight (Specific), % IACS 4.7
15

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.4
Embodied Carbon, kg CO2/kg material 5.1
15
Embodied Energy, MJ/kg 74
260

Common Calculations

Stiffness to Weight: Axial, points 8.6
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 12 to 19
2.2
Strength to Weight: Bending, points 13 to 18
4.5
Thermal Diffusivity, mm2/s 7.7
28
Thermal Shock Resistance, points 12 to 20
3.6

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 70.6
3.5 to 4.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.4 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 29 to 33
0 to 0.010
Silver (Ag), % 0
0.8 to 1.2
Tin (Sn), % 0
93.8 to 95.7
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0