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C72150 Copper-nickel vs. C12500 Copper

Both C72150 copper-nickel and C12500 copper are copper alloys. They have 55% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 150
120
Elongation at Break, % 29
1.5 to 50
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 55
43
Shear Strength, MPa 320
150 to 220
Tensile Strength: Ultimate (UTS), MPa 490
220 to 420
Tensile Strength: Yield (Proof), MPa 210
75 to 390

Thermal Properties

Latent Heat of Fusion, J/g 250
210
Maximum Temperature: Mechanical, °C 600
200
Melting Completion (Liquidus), °C 1210
1080
Melting Onset (Solidus), °C 1250
1070
Specific Heat Capacity, J/kg-K 410
390
Thermal Conductivity, W/m-K 22
350
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
92
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
93

Otherwise Unclassified Properties

Base Metal Price, % relative 45
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 6.1
2.6
Embodied Energy, MJ/kg 88
41
Embodied Water, L/kg 270
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 120
5.6 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 150
24 to 660
Stiffness to Weight: Axial, points 9.1
7.2
Stiffness to Weight: Bending, points 20
18
Strength to Weight: Axial, points 15
6.9 to 13
Strength to Weight: Bending, points 15
9.1 to 14
Thermal Diffusivity, mm2/s 6.0
100
Thermal Shock Resistance, points 18
7.8 to 15

Alloy Composition

Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Carbon (C), % 0 to 0.1
0
Copper (Cu), % 52.5 to 57
99.88 to 100
Iron (Fe), % 0 to 0.1
0
Lead (Pb), % 0 to 0.050
0 to 0.0040
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 43 to 46
0 to 0.050
Silicon (Si), % 0 to 0.5
0
Tellurium (Te), % 0
0 to 0.025
Zinc (Zn), % 0 to 0.2
0
Residuals, % 0
0 to 0.3