C72800 Copper-nickel vs. Solder Alloy 101
C72800 copper-nickel belongs to the copper alloys classification, while solder alloy 101 belongs to the otherwise unclassified metals. There are 26 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.
For each property being compared, the top bar is C72800 copper-nickel and the bottom bar is solder alloy 101.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 38 |
| Elongation at Break, % | 3.9 to 23 | |
| 48 |
| Poisson's Ratio | 0.34 | |
| 0.39 |
| Shear Modulus, GPa | 44 | |
| 14 |
| Tensile Strength: Ultimate (UTS), MPa | 520 to 1270 | |
| 31 |
| Tensile Strength: Yield (Proof), MPa | 250 to 1210 | |
| 27 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 46 |
| Melting Completion (Liquidus), °C | 1080 | |
| 180 |
| Melting Onset (Solidus), °C | 920 | |
| 180 |
| Specific Heat Capacity, J/kg-K | 380 | |
| 190 |
| Thermal Conductivity, W/m-K | 55 | |
| 51 |
| Thermal Expansion, µm/m-K | 17 | |
| 25 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 11 | |
| 12 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 11 | |
| 12 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.8 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 4.4 | |
| 11 |
| Embodied Energy, MJ/kg | 68 | |
| 180 |
| Embodied Water, L/kg | 360 | |
| 930 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 37 to 99 | |
| 14 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 260 to 5650 | |
| 9.9 |
| Stiffness to Weight: Axial, points | 7.4 | |
| 2.4 |
| Stiffness to Weight: Bending, points | 19 | |
| 13 |
| Strength to Weight: Axial, points | 17 to 40 | |
| 1.0 |
| Strength to Weight: Bending, points | 16 to 30 | |
| 2.5 |
| Thermal Diffusivity, mm2/s | 17 | |
| 31 |
| Thermal Shock Resistance, points | 19 to 45 | |
| 2.4 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.1 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 to 0.020 | |
| 0 to 0.2 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0 to 0.0010 | |
| 0 to 0.1 |
| Boron (B), % | 0 to 0.0010 | |
| 0 |
| Cadmium (Cd), % | 0 | |
| 0 to 0.0020 |
| Copper (Cu), % | 78.3 to 82.8 | |
| 0 to 0.080 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Indium (In), % | 0 | |
| 0 to 0.1 |
| Iron (Fe), % | 0 to 0.5 | |
| 0 to 0.020 |
| Lead (Pb), % | 0 to 0.0050 | |
| 35.8 to 37.5 |
| Magnesium (Mg), % | 0.0050 to 0.15 | |
| 0 |
| Manganese (Mn), % | 0.050 to 0.3 | |
| 0 |
| Nickel (Ni), % | 9.5 to 10.5 | |
| 0 to 0.010 |
| Niobium (Nb), % | 0.1 to 0.3 | |
| 0 |
| Phosphorus (P), % | 0 to 0.0050 | |
| 0 |
| Silicon (Si), % | 0 to 0.050 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0 to 0.1 |
| Sulfur (S), % | 0 to 0.0025 | |
| 0 |
| Tin (Sn), % | 7.5 to 8.5 | |
| 62.5 to 63.5 |
| Titanium (Ti), % | 0 to 0.010 | |
| 0 |
| Zinc (Zn), % | 0 to 1.0 | |
| 0 to 0.0010 |
| Residuals, % | 0 to 0.3 | |
| 0 |