C96700 Copper vs. Solder Alloy 502
C96700 copper belongs to the copper alloys classification, while solder alloy 502 belongs to the otherwise unclassified metals. There are 20 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is C96700 copper and the bottom bar is solder alloy 502.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 140 | |
| 53 |
| Elongation at Break, % | 10 | |
| 34 |
| Poisson's Ratio | 0.33 | |
| 0.36 |
| Shear Modulus, GPa | 53 | |
| 19 |
| Tensile Strength: Ultimate (UTS), MPa | 1210 | |
| 58 |
Thermal Properties
| Latent Heat of Fusion, J/g | 250 | |
| 66 |
| Melting Completion (Liquidus), °C | 1170 | |
| 350 |
| Melting Onset (Solidus), °C | 1110 | |
| 220 |
| Specific Heat Capacity, J/kg-K | 400 | |
| 230 |
| Thermal Conductivity, W/m-K | 30 | |
| 47 |
| Thermal Expansion, µm/m-K | 15 | |
| 22 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.8 | |
| 7.4 |
| Embodied Carbon, kg CO2/kg material | 9.5 | |
| 15 |
| Embodied Energy, MJ/kg | 140 | |
| 260 |
Common Calculations
| Stiffness to Weight: Axial, points | 8.9 | |
| 4.0 |
| Stiffness to Weight: Bending, points | 20 | |
| 17 |
| Strength to Weight: Axial, points | 38 | |
| 2.2 |
| Strength to Weight: Bending, points | 29 | |
| 4.5 |
| Thermal Diffusivity, mm2/s | 8.5 | |
| 28 |
| Thermal Shock Resistance, points | 40 | |
| 3.6 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0 | |
| 0 to 0.1 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Beryllium (Be), % | 1.1 to 1.2 | |
| 0 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.080 |
| Cadmium (Cd), % | 0 | |
| 0 to 0.0020 |
| Copper (Cu), % | 62.4 to 68.8 | |
| 3.5 to 4.5 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Indium (In), % | 0 | |
| 0 to 0.1 |
| Iron (Fe), % | 0.4 to 1.0 | |
| 0 to 0.020 |
| Lead (Pb), % | 0 to 0.010 | |
| 0 to 0.070 |
| Manganese (Mn), % | 0.4 to 1.0 | |
| 0 |
| Nickel (Ni), % | 29 to 33 | |
| 0 to 0.010 |
| Silicon (Si), % | 0 to 0.15 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0.8 to 1.2 |
| Tin (Sn), % | 0 | |
| 93.8 to 95.7 |
| Titanium (Ti), % | 0.15 to 0.35 | |
| 0 |
| Zinc (Zn), % | 0 | |
| 0 to 0.0010 |
| Zirconium (Zr), % | 0.15 to 0.35 | |
| 0 |
| Residuals, % | 0 to 0.5 | |
| 0 |