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C96900 Copper-nickel vs. Solder Alloy 502

C96900 copper-nickel belongs to the copper alloys classification, while solder alloy 502 belongs to the otherwise unclassified metals. There are 20 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C96900 copper-nickel and the bottom bar is solder alloy 502.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Elongation at Break, % 4.5
34
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 45
19
Tensile Strength: Ultimate (UTS), MPa 850
58

Thermal Properties

Latent Heat of Fusion, J/g 210
66
Melting Completion (Liquidus), °C 1060
350
Melting Onset (Solidus), °C 960
220
Specific Heat Capacity, J/kg-K 380
230
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 9.2
15

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.4
Embodied Carbon, kg CO2/kg material 4.6
15
Embodied Energy, MJ/kg 72
260

Common Calculations

Stiffness to Weight: Axial, points 7.7
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 27
2.2
Strength to Weight: Bending, points 23
4.5
Thermal Shock Resistance, points 30
3.6

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 73.6 to 78
3.5 to 4.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0.050 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silicon (Si), % 0 to 0.3
0
Silver (Ag), % 0
0.8 to 1.2
Tin (Sn), % 7.5 to 8.5
93.8 to 95.7
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0