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N10665 Nickel vs. C11400 Copper

N10665 nickel belongs to the nickel alloys classification, while C11400 copper belongs to the copper alloys. There are 30 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is N10665 nickel and the bottom bar is C11400 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 220
120
Elongation at Break, % 45
2.8 to 51
Poisson's Ratio 0.31
0.34
Rockwell B Hardness 86
10 to 62
Shear Modulus, GPa 84
43
Shear Strength, MPa 600
150 to 210
Tensile Strength: Ultimate (UTS), MPa 860
220 to 400
Tensile Strength: Yield (Proof), MPa 400
75 to 400

Thermal Properties

Latent Heat of Fusion, J/g 310
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1620
1080
Melting Onset (Solidus), °C 1570
1030
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 11
390
Thermal Expansion, µm/m-K 10
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.3
100
Electrical Conductivity: Equal Weight (Specific), % IACS 1.2
100

Otherwise Unclassified Properties

Base Metal Price, % relative 75
32
Density, g/cm3 9.3
9.0
Embodied Carbon, kg CO2/kg material 15
2.6
Embodied Energy, MJ/kg 200
42
Embodied Water, L/kg 270
350

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 320
11 to 90
Resilience: Unit (Modulus of Resilience), kJ/m3 360
24 to 680
Stiffness to Weight: Axial, points 13
7.2
Stiffness to Weight: Bending, points 22
18
Strength to Weight: Axial, points 26
6.8 to 12
Strength to Weight: Bending, points 22
9.1 to 14
Thermal Diffusivity, mm2/s 3.1
110
Thermal Shock Resistance, points 27
7.8 to 14

Alloy Composition

Carbon (C), % 0 to 0.020
0
Chromium (Cr), % 0 to 1.0
0
Cobalt (Co), % 0 to 1.0
0
Copper (Cu), % 0
99.84 to 99.966
Iron (Fe), % 0 to 2.0
0
Manganese (Mn), % 0 to 1.0
0
Molybdenum (Mo), % 26 to 30
0
Nickel (Ni), % 64.8 to 74
0
Phosphorus (P), % 0 to 0.040
0
Silicon (Si), % 0 to 0.1
0
Silver (Ag), % 0
0.034 to 0.060
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.1