As Hot Rolled (M20) C12500 Copper
M20 C12500 copper is C12500 copper in the M20 (as hot rolled) condition. The graph bars on the material properties cards below compare M20 C12500 copper to: wrought coppers (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.
Mechanical Properties
Elastic (Young's, Tensile) Modulus
120 GPa 17 x 106 psi
Elongation at Break
50 %
Poisson's Ratio
0.34
Rockwell F Hardness
42
Shear Modulus
43 GPa 6.3 x 106 psi
Shear Strength
150 MPa 22 x 103 psi
Tensile Strength: Ultimate (UTS)
230 MPa 33 x 103 psi
Tensile Strength: Yield (Proof)
75 MPa 11 x 103 psi
Thermal Properties
Latent Heat of Fusion
210 J/g
Maximum Temperature: Mechanical
200 °C 390 °F
Melting Completion (Liquidus)
1080 °C 1980 °F
Melting Onset (Solidus)
1070 °C 1950 °F
Specific Heat Capacity
390 J/kg-K 0.092 BTU/lb-°F
Thermal Conductivity
350 W/m-K 200 BTU/h-ft-°F
Thermal Expansion
17 µm/m-K
Electrical Properties
Electrical Conductivity: Equal Volume
92 % IACS
Electrical Conductivity: Equal Weight (Specific)
93 % IACS
Otherwise Unclassified Properties
Base Metal Price
31 % relative
Density
8.9 g/cm3 560 lb/ft3
Embodied Carbon
2.6 kg CO2/kg material
Embodied Energy
41 MJ/kg 18 x 103 BTU/lb
Embodied Water
310 L/kg 37 gal/lb
Common Calculations
Resilience: Ultimate (Unit Rupture Work)
88 MJ/m3
Resilience: Unit (Modulus of Resilience)
24 kJ/m3
Stiffness to Weight: Axial
7.2 points
Stiffness to Weight: Bending
18 points
Strength to Weight: Axial
7.0 points
Strength to Weight: Bending
9.2 points
Thermal Diffusivity
100 mm2/s
Thermal Shock Resistance
8.0 points
Alloy Composition
Cu | 99.88 to 100 | |
Ni | 0 to 0.050 | |
Te | 0 to 0.025 | |
As | 0 to 0.012 | |
Pb | 0 to 0.0040 | |
Bi | 0 to 0.0030 | |
Sb | 0 to 0.0030 | |
res. | 0 to 0.3 |
All values are % weight. Ranges represent what is permitted under applicable standards.
Followup Questions
Further Reading
Copper Alloys: Preparation, Properties and Applications, Michael Naboka and Jennifer Giordano (editors), 2013